AI in Physical Implementation | DV Club Edinburgh
AI in Physical Implementation | DV Club Edinburgh
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AI in Physical Implementation | DV Club Edinburgh
About the Event
Artificial intelligence is rapidly moving deeper into the semiconductor development flow.
While much of the discussion around AI in chip development has focused on RTL design, verification and software, there is growing potential for AI to support and transform the physical implementation of semiconductor and FPGA designs.
This DV Club session will explore how AI is being applied at the lower levels of the design and implementation process, from FPGAs and timing analysis through to analogue and mixed-signal design, physical layout, chip implementation, thermal management and advanced packaging.
The session will bring together experts from across the semiconductor ecosystem to discuss practical applications, emerging approaches and the challenges of applying AI to increasingly complex physical design problems.
Topics may include
AI-assisted FPGA implementation and optimisation
Timing analysis, optimisation and closure
AI for physical design and chip implementation
Automated and intelligent layout
AI in analogue and mixed-signal design
Placement and routing optimisation
Power, performance and area optimisation
Thermal analysis and thermal-aware design
Semiconductor packaging and advanced packaging
AI-assisted design space exploration
Predictive modelling and optimisation
Integrating AI into existing physical design flows
Challenges, limitations and opportunities for AI in physical implementation
Why Attend?
Understand how AI is being applied beyond traditional RTL and verification
Explore emerging AI techniques for physical implementation
Learn how AI can help tackle increasingly complex design optimisation problems
Hear practical insights from engineers and technology experts
Discover opportunities to improve design productivity and efficiency
Understand the challenges of applying AI to physical design workflows
Connect with others working across semiconductor design and implementation
Who Should Attend?
This session is aimed at professionals and researchers working in:
Physical Design
FPGA Design
ASIC and SoC Design
Timing and Sign-off
Analogue and Mixed-Signal Design
Layout
Power and Thermal Analysis
Semiconductor Packaging
EDA
Design Automation
AI for Semiconductor Design
Semiconductor Research
Registration
Attendance is free, but registration is required.
Join us online to explore how AI is moving into the physical layers of semiconductor design and implementation, and what this could mean for the future of chip development.
Online joining details will be sent to registered attendees before the event.
👉 Also Register for Hands-on AI in Formal Verification Training (Edinburgh or online)
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Location
King’s Buildings campus, University of Edinburgh